Metal whiskering is a phenomenon which occurs in electrical devices. Tin whiskers were noticed and documented in the vacuum tube era of electronics early in the 20th century, in equipment which used pure, or almost pure, tin solder in their production. It was noticed that small metal hairs or tendrils grew between metal solder pads causing short circuits. Metal whiskers form in the presence of compressive stress. Zinc, cadmium, and even lead whiskers have been documented. Many techniques are used to mitigate the problem including changes to the annealing process (heating and cooling), addition of elements like copper and nickel, and the inclusion of conformal coatings. Traditionally, lead was added to slow down whisker growth in tin-based solders. Following the Restriction of Hazardous Substances Directive (RoHS), the European Union banned the use of lead in most consumer electronic products in the early 21st century due to health problems associated with lead and the “high-tech trash” problem, leading to a re-focusing on the issue of whisker formation in lead-free solders.

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